In this paper, an additive method to make electrical contacts in SOI MEMS devices with aerosol jet printing is introduced. Small grooves were etched to the frame of MEMS accelerometer in the same step with the active structure release. Aluminum ink was jetted to the trenches in wafer-level to bridge the device layer to the handle wafer with the minimum amount of material. After subsequent annealing, ohmic contacts between p-type device layer and p-type handle silicon were verified by
Note from Journals.Today : This content has been auto-generated from a syndicated feed.